• 5 state-of -the-art SMD-lines with flexible line concepts
• Production capacities for prototype up to large-scale production
• SMD assembly of all standard components
(BGA, QFP, Flipchip up to 0.3mm, SMD to 01005)
• Several assembly technologies (THT, Pin-in-Paste etc.)
• Force-controlled assembly of connectors and mechanical parts (ODD form)
• State-of-the-art soldering systems (wave, reflow, selective, robot, vapour phase)
• Own nitrogen production for protective-gas soldering