| • 5 state-of -the-art SMD-lines with flexible line concepts |
| • Production capacities for prototype up to large-scale production |
| • SMD assembly of all standard components (BGA, QFP, Flipchip up to 0.3mm, SMD to 01005) |
| • Several assembly technologies (THT, Pin-in-Paste etc.) |
| • Force-controlled assembly of connectors and mechanical parts (ODD form) |
| • State-of-the-art soldering systems (wave, reflow, selective, robot, vapour phase) |
| • Own nitrogen production for protective-gas soldering |