• 5 state-of -the-art SMD-lines with flexible line concepts |
• Production capacities for prototype up to large-scale production |
• SMD assembly of all standard components (BGA, QFP, Flipchip up to 0.3mm, SMD to 01005) |
• Several assembly technologies (THT, Pin-in-Paste etc.) |
• Force-controlled assembly of connectors and mechanical parts (ODD form) |
• State-of-the-art soldering systems (wave, reflow, selective, robot, vapour phase) |
• Own nitrogen production for protective-gas soldering |